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E6E Semiconductor materials and packages for RF use

  • E6E01 (B) Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies? #card
    • A. Higher noise figures
    • B. Higher electron mobility
    • C. Lower junction voltage drop
    • D. Lower transconductance
  • E6E02 (A) Which of the following device packages is a through-hole type? #card
  • E6E03 (D) Which of the following materials supports the highest frequency of operation when used in MMICs? #card
    • A. Silicon
    • B. Silicon nitride
    • C. Silicon dioxide
    • D. Gallium nitride
  • E6E04 (A) Which is the most common input and output impedance of MMICs? #card
    • A. 50 ohms
    • B. 300 ohms
    • C. 450 ohms
    • D. 75 ohms
  • E6E05 (A) Which of the following noise figure values is typical of a low-noise UHF preamplifier? #card
    • A. 0.5 dB
    • B. -10 dB
    • C. 44 dBm
    • D. -20 dBm
  • E6E06 (D) What characteristics of MMICs make them a popular choice for VHF through microwave circuits? #card
    • A. The ability to retrieve information from a single signal, even in the presence of other strong signals
    • B. Extremely high Q factor and high stability over a wide temperature range
    • C. Nearly infinite gain, very high input impedance, and very low output impedance
    • D. Controlled gain, low noise figure, and constant input and output impedance over the specified frequency range
  • E6E07 (D) What type of transmission line is often used for connections to MMICs? #card
    • A. Miniature coax
    • B. Circular waveguide
    • C. Parallel wire
    • D. Microstrip
  • E6E08 (C) How is power supplied to the most common type of MMIC? #card
    • A. Through a capacitor and RF choke connected to the amplifier input lead
    • B. MMICs require no operating bias
    • C. Through a resistor and/or RF choke connected to the amplifier output lead
    • D. Directly to the bias voltage (Vcc) lead
  • E6E09 (D) Which of the following component package types have the least parasitic effects at frequencies above the HF range? #card
    • A. TO-220
    • B. Axial lead
    • C. Radial lead
    • D. Surface mount
  • E6E10 (D) What advantage does surface-mount technology offer at RF compared to using through-hole components? #card
    • A. Smaller circuit area
    • B. Shorter circuit board traces
    • C. Components have less parasitic inductance and capacitance
    • D. All these choices are correct
  • E6E11 (D) What is a characteristic of DIP packaging used for integrated circuits? #card
    • A. Extremely low stray capacitance (dielectrically isolated package)
    • B. Extremely high resistance between pins (doubly insulated package)
    • C. Two chips in each package (dual in package)
    • D. Two rows of connecting pins on opposite sides of package (dual in-line package)
  • E6E12 (C) Why are DIP through-hole package ICs not typically used at UHF and higher frequencies? #card
    • A. Excessive dielectric loss
    • B. Epoxy coating is conductive above 300 MHz
    • C. Excessive lead length
    • D. Unsuitable for combining analog and digital signals